Overview
The ZONESUN ZS-AGD5 is a fully automatic two-component (A/B) glue dispensing machine designed for precise mixing and quantitative dispensing of dual-component adhesives including AB glue, epoxy resin, silicone, polyurethane, and similar two-part materials. Featuring automatic ratio control (1:1 to 1:10 adjustable), ±2% dispensing accuracy, and an automatic cleaning function to prevent glue curing in the mixing head, the ZS-AGD5 delivers stable, repeatable dispensing performance across continuous production shifts. Controlled via a user-friendly PLC system, it is widely deployed in electronics, LED products, power supplies, electrical appliances, handicrafts, and automotive parts manufacturing.
Technical Parameters
- Model: ZS-AGD5
- Glue Tank Capacity: Tank A: 20L, Tank B: 20L (customizable)
- Cleaning Tank: 1L
- Working Voltage: AC 220V, 50Hz
- Power: 700W
- Air Supply: 0.5–0.6 MPa
- Working Temperature: 5–40°C
- Working Humidity: 20–90%
- Dispensing Accuracy: ±2%
- Dispensing Speed: 1–10 g/s (adjustable)
- Glue Ratio: 1:1 to 1:10 (optional)
- Machine Dimensions: 1000 × 400 × 1450 mm (standard)
- Machine Weight: 120 kg
- Packing Dimensions: 1100 × 500 × 1160 mm
- Packing Weight: 150 kg
CONTROL PANEL
Adopts an intuitive control interface to monitor system operations and adjust key technical parameters such as dispensing volume, speed, and timing in real time.
MANUAL VALVE
Combines component A and B through a dynamic/static mixer and dispenses the blended glue onto products with high precision in real time.
A GLUE PRESSURE TANK
Stores component A, adjusts the mixing speed via the regulator, and utilizes a heater to maintain optimal fluid temperature and real-time uniform consistency.
B GLUE PRESSURE TANK
Stores component B under stable pressure to ensure a steady and continuous real-time supply to the dispensing valve.
CLEANING TANK
Stores cleaning fluid to flush the dispensing nozzle and mixing valve after operation to prevent glue curing and clogging.
FEED PORT
Accurately measures and pumps component A and B fluids in real time to ensure precise mixing ratios and stable dispensing volume.
Key Features
- Automatic A/B Ratio Control (1:1 to 1:10): Programmable ratio control covers the full range of standard two-component adhesive mix ratios, enabling the same machine to handle different adhesive formulations without mechanical pump replacement — simply adjust the ratio parameter via the PLC interface.
- ±2% Dispensing Accuracy: Precision metering pumps maintain consistent A and B component volumes within ±2% tolerance across the full dispensing speed range, ensuring repeatable bond strength and minimizing adhesive waste on high-volume production lines.
- Automatic Cleaning Function — Anti-Curing Protection: Built-in automatic cleaning cycle flushes the mixing head and dispensing nozzle with solvent at programmable intervals, preventing two-component adhesive from curing inside the system during pauses or shift changes — eliminating manual cleaning downtime and nozzle replacement costs.
- Adjustable Dispensing Speed (1–10 g/s): Variable flow rate allows operators to match dispensing speed to substrate size, bond area, and downstream cure time requirements — from fine bead application on small electronic components to larger potting fills on power supply housings.
- Large-Capacity Dual Tanks (20L + 20L, Customizable): Standard 20-liter tanks for both A and B components support extended production runs without frequent refilling; tank size is customizable for high-volume operations requiring larger reservoirs.
- PLC Control System with User-Friendly Interface: Programmable logic controller stores multiple dispensing programs for different products, enabling rapid recipe changeover between SKUs without manual recalibration of ratio or speed settings.
- Broad Adhesive Compatibility: Handles AB glue, epoxy resin, silicone, polyurethane, and other dual-component adhesives with varying viscosities and pot lives — a single machine serves multiple adhesive types across different production applications.
- Compact Industrial Footprint (1000 × 400 × 1450 mm): Slim upright design minimizes floor space usage while accommodating full dual-tank, pump, and control system assembly — suitable for integration into existing assembly line layouts.
Applications
- Electronics & PCB Assembly: Potting and encapsulation of PCBs, connectors, sensors, and electronic modules with epoxy or polyurethane to protect against moisture, vibration, and thermal stress.
- LED Lighting Manufacturing: Dispensing of silicone or epoxy encapsulant into LED strip housings, COB modules, and LED driver assemblies for optical clarity and environmental protection.
- Power Supply & Transformer Potting: Filling of power supply enclosures and transformer housings with two-component polyurethane or epoxy for electrical insulation and heat dissipation.
- Automotive Parts Assembly: Bonding and sealing of automotive sensors, control units, lighting assemblies, and structural components requiring precise two-component adhesive application under production line conditions.
- Electrical Appliance Manufacturing: Potting of motor windings, switch assemblies, and electrical junction boxes with two-component adhesive for moisture resistance and mechanical protection.
- Handicrafts & Decorative Products: Precision AB glue dispensing for resin casting, jewelry making, decorative inlay, and craft assembly applications requiring controlled mix ratios and consistent bead placement.
- Medical Device Assembly: Bonding and sealing of medical device housings, sensor assemblies, and diagnostic equipment components with biocompatible two-component adhesives under controlled dispensing conditions.